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Insert XML into SQL Server table with XML namespace using SSIS
I am trying to insert an XML document that has been obtained from a web service into a SQL Server 2008 database table. The XML document comes from a URL. The full XML document is too big to pass as a variable and I’d like to avoid creating a temporary table/structure and inserting it into the table. The XML document has a namespace declaration.
The XML seems to be always the same, but the namespace declaration can be different.
I am using a Flat File Source and a Derived Column Transformation to get the XML into a string. There is something wrong with this approach as I can’t seem to add the namespace declaration into the string in the correct way.
I am currently getting the following exception:
Cannot resolve the identity/authority or one of the components
reference from the current context, as the database has not been
explicitly specified as the Data Source.
This is what I am doing at the moment:
Create a Variable
Set the XML to be used into it using a Flat File Source
Create a Derived Column Transformation
Create another Variable to place the XML as a String
Use a Script Transformation to concaten
Cinema of India
Indo-Canadian filmThe present invention relates to a semiconductor device with a layout structure and a method for manufacturing a semiconductor device. In particular, the invention relates to a structure in which to connect an electrode pad of a semiconductor chip with an external device, such as a printed wiring board.
With development of larger scale integration, enhancement of mounting density, and miniaturization of circuit, a higher mounting density is required for mounting various devices, including a semiconductor device, on a mounting substrate. In the case of a semiconductor device, to achieve a higher mounting density, the size of a semiconductor chip including an integrated circuit formed therein is reduced and the number of external connection terminals per unit area is increased.
FIG. 6 is a plan view illustrating a state in which a plurality of pads (external connection terminals) formed on a semiconductor chip are connected to a semiconductor substrate. In a semiconductor chip 100, a pad 101 is located in the center. A plurality of pads 102 and 103 are located in a peripheral region of the semiconductor chip 100. The peripheral region of the semiconductor chip 100 has an area significantly larger than that of the region where the pad 101 is located. The peripheral region includes a large number of pads because the region is a power supply region, a clock input region, and a ground region.
As described above, in a semiconductor chip having a plurality of pads (external connection terminals), the pads formed in a peripheral region are arranged far from the region where a semiconductor integrated circuit chip including a semiconductor device is formed, and the entire area of the peripheral region is large. Therefore, wiring from each pad to the circuit chip is long and the resistance is high.
In general, a space between pads is preferably larger than or equal to the wiring length of the wirings connecting the pads. When the distance between pads is too small, the resistance of the wirings connecting the pads increases and heat radiation from the whole chip is affected. Therefore, in the case of a semiconductor device, to increase the mounting density, it is preferable that the distance between pads is larger than or equal to the wiring length of the wirings connecting the pads. The reason is that, when the distance between pads is smaller than the wiring length of the wirings connecting the pads, it becomes necessary to make the wiring length longer by
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